From Standard To Full Custom Devices

Standard
Sensor devices are batch produced in industrial quantities and mounted on standard packages.

Semi-custom
Devices with different sensor designs can be produced together in a multi-client context with the same technology platform. For your application including multi-parameters sensing needs, MICROSENS can manufacture microsystems with your dedicated operation mode and calibration procedure.

Full-custom
MICROSENS develops integrated sensors as well as original microsystems using the most appropriate design, sensing materials, electronic interfaces and packaging, with the individual application in mind. Based on your product specifications, new microsystems with custom on-board programmable functions for sensors conditioning, calibration, intelligent data preprocessing, communication interface, can be realized and manufactured after field evaluation of prototypes by your engineers.

Achieving optimum miniaturization, cost and performance

From Integrated Sensors To Measurement Systems
The devices and microsystems are supplied at four different levels, to offer better use of integrated technology and the added functions of microsystems:

1. Integrated sensor "chips"
2. Sensor devices mounted in application specific packages
3. Sensor microsystems with signal conditioning and compensation (i.e. temperature, humidity), programmable data processing and operation modes, stored calibration parameters and standard data exchange bus, for easy setup and in field sensor microsystems maintenance or interchangeability.
4. Measuring instruments combining integrated sensors or sensors microsystem, interface electronics and data processing with specific output signals.

Technological Highlights

Standard microelectronics
Standard CMOS processes as a basic technology for the manufacture of many different sensor devices.

Specific post-processing

• Specific thin and thick film technology for depositing and structuring sensor materials
• Selective organic membrane deposition with photopolymer technology
• Silicon micro-structuring for threedimensional sensor structure manufacturing

Packaging

• Standard IC packages such as TO or DIL
• Specific "chip on board" mounting on PCB (printed circuit board) or TAB (tape automated bonding)
• Application-specific packaging with hermetic sealing